200mm Silicon Wafers - 8 Inch Silicon Wafers | Silicon Materials Inc.

8 Inch (200.0mm)
Silicon Wafer Specifications

Material Properties

Parameter	Characteristic	ASTM Control Method
Method of Growth	Cz, Fz, MCz
Type/Dopant	P - Boron, N - Phosphorous, N - Antimony, N - Arsenic Undoped	F42
Orientations	<100>, <111>, <110>, <112> slice off orientations per customer's request	F26
Oxygen Content	10-19 ppmA Custom tolerances per customer's request	F121
Carbon Content	< 1 ppmA Custom tolerances per customer's request	F123
Resistivity ranges P - Boron, N - Phosphorous, N - Antimony, N - Arsenic Undoped	0.001 - 50 ohm cm 0.1 - 40 ohm cm 0.01 - 0.025 ohm cm 0.001 - 0.005 ohm cm > 100 ohm cm Custom tolerances per customer's request	F84

Mechanical Properties

Parameter	Prime A	Prime B	Test	ASTM Method
Diameter	200 ± 0.2 mm	200 ± 0.2 mm	200 ± 0.5 mm	F2074
Thickness	725 ± 20 µm (standard) 600 ± 20 µm 1000 ± 20 µm 1200 ± 20 µm 1300 ± 20 µm 1500 ± 20 µm	725 ± 25 µm (standard) 600 ± 25 µm 1000 ± 25 µm 1200 ± 25 µm 1300 ± 25 µm 1500 ± 25 µm	725 ± 50 µm (standard) 600 ± 50 µm 1000 ± 50 µm 1200 ± 50 µm 1300 ± 50 µm 1500 ± 50 µm	F533
Thickness	Alternative customer's request will be considered
TTV	< 5 µm	< 10 µm	< 15 µm	F533
TTV	Alternative customer's request will be considered
Bow	< 30 µm	< 30 µm	< 40 µm	F534
Bow	Alternative customer's request will be considered
Warp	< 30 µm	< 30 µm	< 40 µm	F657
Warp	Alternative customer's request will be considered
Edge Rounding	SEMI-STD or per customer's request			F928
Marking	Jeida - STD Flat only, Notch			F847, F671

Surface Quality

Parameter	Prime A	Prime B	Test	ASTM Method
*Front Side Criteria*
Surface condition	Chemical-Mechanical Polished			F523
Surface Roughness	< 2 A°	< 2 A°	< 2 A°
Contamination,Particles @ >0.3 µm	< 30	< 30	< 40	F523
Haze, Pits, Orange peel	None	None	None	F523
Saw Marks, striations	None	None	None	F523
*Back Side Criteria*
Surface condition	Caustic etched
Cracks, crowsfeet, saw marks,stains	None	None	None	F523

Parameter	Prime A	Prime B	Test	ASTM Method
*Front Side Criteria*
Surface condition	Chemical-Mechanical Polished			F523
Surface Roughness	< 2 A°	< 2 A°	< 2 A°
Contamination,Particles @ >0.3 µm	< 30	< 30	< 40	F523
Haze, Pits, Orange peel	None	None	None	F523
Saw Marks, striations	None	None	None	F523
*Back Side Criteria*
Surface condition	Chemical-Mechanical Polished			F523
Surface Roughness	< 20 A°	< 20 A°	< 20 A°
Haze, Pits, Orange peel	None	None	None	F523
Saw Marks, striations	None	None	None	F523

Packaging options

Packaging	Description of bags
3-Part Cassette, 2 Bags	Clear Gusset, A/S Blue Flat
Single Wafer Shipper, 3 Bags	Clear Gusset, AL Gusset , A/S Blue Flat
Jar Tyvek Separated