3 Inch (76.2mm)
Silicon Wafer Specifications

Material Properties

Parameter Characteristic ASTM Control Method
Method of Growth Cz, Fz  
Type/Dopant P - Boron,
N - Phosphorous,
N - Antimony,
N - Arsenic
Undoped		 F42
Orientations <100>, <111>, <110> slice ON or slice OFF orientations per customer's request F26
Oxygen Content 10-19 ppmA Custom tolerances per customer's request F121
Carbon Content < 1 ppmA Custom tolerances per customer's request F123
Resistivity ranges
P - Boron,
N - Phosphorous,
N - Antimony,
N - Arsenic
Undoped
0.001 - 50 ohm cm
0.1 - 40 ohm cm
0.01 - 0.025 ohm cm
0.001 - 0.005 ohm cm
> 100 ohm cm
Custom tolerances per customer's request		 F84

Mechanical Properties

Parameter Prime A Prime B Test ASTM Method
Diameter 3" ± 0.008" 3" ± 0.008" 3" ± 0.02" F2074
Thickness 381 ± 20 µm (standard)
305 ± 20 µm
635 ± 20 µm
750 ± 20 µm
1000 ± 20 µm		 381 ± 25 µm (standard)
305 ± 25 µm
635 ± 25 µm
750 ± 25 µm
1000 ± 25 µm		 381 ± 50 µm (standard)
305 ± 50 µm
635 ± 20 µm
750 ± 50 µm
1000 ± 50 µm		 F533
Alternative customer's request will be considered
TTV < 5 µm < 10 µm < 15 µm F657
Bow < 30 µm < 30 µm < 40 µm F534
Warp < 30 µm < 30 µm < 40 µm F657
Edge Rounding SEMI-STD F928
Marking Primary SEMI-Flat only, SEMI-STD Flats, Notch or Round are offered F847, F671

Surface Quality

Parameter Prime A Prime B Test ASTM Method
Front Side Criteria
Surface condition
Chemical-Mechanical Polished
 F523
Surface Roughness < 2 A° < 2 A° < 2 A°
Contamination,Particles @ >0.3 µm < 20 < 20 < 20 F523
Haze, Pits, Orange peel None None None F523
Saw Marks, striations None None None F523
Back Side Criteria
Cracks, crowsfeet, saw marks,stains None None None F523
Surface condition
Caustic etched
 F523

Packaging options

Packaging Description of bags
2-Part Cassette, 2 Bags Clear Gusset, A/S Blue Flat
3-Part Cassette, 2 Bags Clear Gusset, A/S Blue Flat
Single Wafer Shipper, 3 Bags Clear Gusset, AL Gusset , A/S Blue Flat