50.8mm Silicon Wafers - 2 Inch Silicon Wafers | Silicon Materials Inc.

2 Inch (50.8mm)
Silicon Wafer Specifications

Material Properties

Parameter	Characteristic	ASTM Control Method
Method of Growth	Cz, Fz
Type/Dopant	P - Boron, N - Phosphorous, N - Antimony, N - Arsenic Undoped	F42
Orientations	<100>, <111>, <110> slice ON or slice OFF orientations per customer's request	F26
Oxygen Content	10-19 ppmA Custom tolerances per customer's request	F121
Carbon Content	< 1.0 ppmA Custom tolerances per customer's request	F123
Resistivity ranges - P, Boron - N, Phosphorous - N, Antimony - N, Arsenic	0.001 - 50 ohm cm 0.1 - 40 ohm cm 0.005 - 0.025 ohm cm < 0.005 ohm cm	F84

Mechanical Properties

Parameter	Prime A	Prime B	Test	ASTM Method
Diameter	2" ± 0.008"	2" ± 0.008"	2" ± 0.015"	F2074
Thickness	279 ± 20 µm (standard) 381 ± 20 µm 450 ± 20 µm 500 ± 20 µm 750 ± 20 µm 1000 ± 20 µm	279 ± 25 µm (standard) 381 ± 25 µm 450 ± 25 µm 500 ± 25 µm 750 ± 25 µm 1000 ± 25 µm	279 ± 25 µm (standard) 381 ± 25 µm 450 ± 25 µm 500 ± 25 µm 750 ± 25 µm 1000 ± 25 µm	F533
Thickness	Alternative customer's request will be considered
TTV	< 5 µm	< 10 µm	< 15 µm	F657
Bow	< 38 µm	< 38 µm	< 38 µm	F534
Warp	< 38 µm	< 38 µm	< 38 µm	F657
Edge Rounding	SEMI-STD			F928
Marking	Primary SEMI-Flat only, SEMI-STD Flats, Notch or Round are offered			F26, F671

Surface Quality

Parameter	Prime A	Prime B	Test	ASTM Method
*Front Side Criteria*
Surface condition	Chemical-Mechanical Polished			F523
Surface Roughness	< 2 A°	< 2 A°	< 2 A°
Contamination,Particles @ >0.3 µm	< 15	< 15	< 15	F523
Haze, Pits, Orange peel	None	None	None	F523
Saw Marks, striations	None	None	None	F523
*Back Side Criteria*
Cracks, crowsfeet, saw marks, stains	None	None	None	F523
Surface condition	Caustic etched			F523

Packaging options

Packaging	Description of bags
2-Part Cassette, 2 Bags	Clear Gusset, A/S Blue Flat
3-Part Cassette, 2 Bags	Clear Gusset, A/S Blue Flat
Single Wafer Shipper, 3 Bags	Clear Gusset, AL Gusset , A/S Blue Flat